JPH0451998B2 - - Google Patents

Info

Publication number
JPH0451998B2
JPH0451998B2 JP57002202A JP220282A JPH0451998B2 JP H0451998 B2 JPH0451998 B2 JP H0451998B2 JP 57002202 A JP57002202 A JP 57002202A JP 220282 A JP220282 A JP 220282A JP H0451998 B2 JPH0451998 B2 JP H0451998B2
Authority
JP
Japan
Prior art keywords
plating
conductive layer
lower pattern
conductor
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57002202A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58119694A (ja
Inventor
Masaru Sakaguchi
Toyoji Tsunoda
Ichiro Ishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP220282A priority Critical patent/JPS58119694A/ja
Publication of JPS58119694A publication Critical patent/JPS58119694A/ja
Publication of JPH0451998B2 publication Critical patent/JPH0451998B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP220282A 1982-01-12 1982-01-12 配線基板の製造方法 Granted JPS58119694A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP220282A JPS58119694A (ja) 1982-01-12 1982-01-12 配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP220282A JPS58119694A (ja) 1982-01-12 1982-01-12 配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS58119694A JPS58119694A (ja) 1983-07-16
JPH0451998B2 true JPH0451998B2 (en]) 1992-08-20

Family

ID=11522763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP220282A Granted JPS58119694A (ja) 1982-01-12 1982-01-12 配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS58119694A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0614594B2 (ja) * 1988-08-31 1994-02-23 三井金属鉱業株式会社 リジッドフレキシブルプリント配線板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310657B2 (en]) * 1972-05-15 1978-04-15
JPS4922552A (en]) * 1972-06-26 1974-02-28
JPS5064767A (en]) * 1973-10-12 1975-06-02
JPS5662398A (en) * 1979-10-26 1981-05-28 Nippon Electric Co Method of manufacturing high density multilayer board
JPS56116697A (en) * 1980-02-19 1981-09-12 Nippon Electric Co Method of forming conductor layer on multilayer circuit board

Also Published As

Publication number Publication date
JPS58119694A (ja) 1983-07-16

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